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Amr, Please keep in mind that this is a user forum, not a technical support hotline. The idea of it is for users to assist each other although the developers do try and provide assistance to the user community here as well. If you need assistance quickly, I would recommend that you contact your distributor directly. Also, we are no longer officially supporting Trnsys version 16 as version 17 was released in 2010. Your questions, however, apply to both versions. 1. Trnsys does not have one single method for computing ground heat transfer; it depends on which component (which Type) you are using. The ground coupling components in the TESS Libraries node the ground and use a finite difference approach to model the conduction of energy through the ground. 2. I am not sure whether these are going to do you much good; not because there is no way to connect them to a building but because what happens in the building influences the ground temperature profile, which in turn influences the building. If you have measured the ground temperature profile in undisturbed ground (ie away from a building) then you can apply this profile for the far-field temperature using a ground coupling model. If you do not have a ground coupling model then there is a lot of literature in the field on how to appropriately couple a ground temperature to a building. These range from simply connecting a deep-earth temperature to the back side of the building floors to defining an equivalent thermal resistance to the back side of the ground slab and connecting the other side of the resistive layer to the ambient temperature. I would recommend that you look at the literature and choose a method that is appropriate to the data that you have and that is suitable to what you are trying to model. 3. If you are using Type56, look at the QCOMI and QCOMO outputs for the appropriate surfaces in your building. Best, David On 2/8/2013 03:26, AMR sayed wrote:
-- *************************** David BRADLEY Principal Thermal Energy Systems Specialists, LLC 22 North Carroll Street - suite 370 Madison, WI 53703 USA P:+1.608.274.2577 F:+1.608.278.1475 d.bradley@tess-inc.com http://www.tess-inc.com http://www.trnsys.com |