Re: [TRNSYS-users] Type 260 PCM

To: Eva gklezakou <gklezakoue@gmail.com>, trnsys-users <trnsys-users@cae.wisc.edu>

Subject: Re: [TRNSYS-users] Type 260 PCM

From: saleh saadi <salehsnjsaadi404@yahoo.com>

Date: Thu, 22 Mar 2012 06:16:11 -0700 (PDT)

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Reply-to: saleh saadi <salehsnjsaadi404@yahoo.com>

Dear Eva,

Many Types have been developed over years for PCM modeling in TRNSYS but almost all of them are used for research purposes including the type you mentioned "TYPE 260". People tend not to release these types for public use. However,there is one available free for public use: “TYPE204” but with poor computational efficiency.
URL: http://sel.me.wisc.edu/trnsys/trnlib/library16.htm , look under Thermal Storage Components.

TESS has recently developed a TYPE for $100. This type simulates an internal PCM layer in a wall.

Hopefully, this help.

regards,
saleh alsaadi

From: Eva gklezakou <gklezakoue@gmail.com>
To: trnsys-users <trnsys-users@cae.wisc.edu>
Sent: Thursday, March 22, 2012 5:43 AM
Subject: [TRNSYS-users] Type 260 PCM

Hi,

I am working with TRNSYS 16.1 and I would like to simulate PCM. I found out that there is a component Type 260 which can do this simulation. Does anyone know how to get this component?? Does anyone know if there is any free component for this kind of simulation??

Thanks

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[TRNSYS-users] Type 260 PCM
- From: Eva gklezakou <gklezakoue@gmail.com>